Laminating Equipment - Company Ranking(5 companies in total)
Last Updated： Aggregation Period:Jun 03, 2026〜Jun 30, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Features】 ○ A bonding device that corrects wafer warpage and minimizes the thickness of the wax layer to enable high-precision processing (... | Please feel free to contact us. | ||
| 【Features】 ○ Achieves high-precision polishing of wafers represented by sapphire and GaAs. ○ Reduces pressure in the chamber to minimize the... | Please feel free to contact us. | ||
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テクノライズ株式会社
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- Featured Products
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Vacuum bonding device (bonding apparatus) VAP250
- overview
- 【Features】 ○ A bonding device that corrects wafer warpage and minimizes the thickness of the wax layer to enable high-precision processing (...
- Application/Performance example
- Please feel free to contact us.
Vacuum Bonding Device VSP300
- overview
- 【Features】 ○ Achieves high-precision polishing of wafers represented by sapphire and GaAs. ○ Reduces pressure in the chamber to minimize the...
- Application/Performance example
- Please feel free to contact us.
-
テクノライズ株式会社
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